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Nitric acid

69 %, VLSI Grade
Icon_EVE-EUD Please consider that this product might be liable to some legal sanctions as for example to obtain an end user declaration or the prohibition of some applications. For details please do contact your counterpart in our sales department!
Examples of effect: Have an oxidising effect and intensify fires. Explosive compounds are produced when mixed with combustible substances. Safety: Keep away from and do not mix with combustible substances; store in a clean environment.
Examples of effect: Damage metals and burn body tissues; may cause serious eye damage. Safety: Avoid contact; wear safety spectacles and gloves. In the event of contact with eyes and skin, rinse with water.
Examples of effect: In smaller quantities, lead to immediate serious damage to health or death. Safety: Do not inhale, touch or swallow. Wear work safety equipment. Call a poison control centre or doctor immediately. Recovery position.
Danger
H272-H290-H314-H331-EUH071
i may intensify fire; oxidiser, may be corrosive to metals, causes severe skin burns and eye damage, toxic if inhaled
P220 P260 P280 P303+P361+P353 P305+P351+P338 P310
i keep/store away from combustible materials, do not breathe mist/vapours/spray, wear protective gloves/protective clothing/eye protection/face protection, IF ON SKIN (or hair): Take off immediately all contaminated clothing. Rinse skin with water [or shower], IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing, immediately call a POISON CENTER/doctor
Related products
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Empirical formula HNO3
Molar mass (M) 63,01 g/mol
Density (D) 1,41 g/cm³
Boiling point (bp) 121 °C
ADR 8 II
WGK 1
CAS No. [7697-37-2]
EG-Nr. 231-714-2
UN-Nr. 2031

Semiconductor grade

€155.80/Pack Qty. 

excl. VAT. | 2.5 l per Pack Qty.

Art. No. 1N1K.1

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Nitric acid
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1N1K.1 2.5 l plastic

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Downloads / MSDS


General information

Products in VLSI quality

Carl ROTH's VLSI (Very Large Scale Integration) product line offers solvents and acids for cleaning and etching wafers for the semi-conductor industry. Both processes are essential for chip manufacture. Carl ROTH offers a selected range of products.


Solvents

Properties:

  • High purity
  • Trace metal content usually below 100 ppb
  • Particle-filtered, maximal 250 particles/ml


Certificates of Analysis

You can search for and download your certificate of analysis for the selected product here. Please provide your batch number.
The following analysis certificates have been found:

Guarantee analysis

Assay69-70 %
Bead number (≥0,5 µm)≤250 p/ml
Chloride (Cl)≤0.00001 %
Colour (APHA)≤10
Ash content (as SO4)≤0.0002 %
Phosphate (PO4)≤0.00001 %
Heavy metals (as Pb)≤0.0001 %
Sulphate (SO4)≤0.00005 %
Trace impurities
Silver (Ag)≤0.01 ppm
Aluminium (Al)≤0.05 ppm
Arsenic (As)≤0.01 ppm
Gold (Au)≤0.05 ppm
Boron (B)≤0.01 ppm
Barium (Ba)≤0.1 ppm
Beryllium (Be)≤0.02 ppm
Bismuth (Bi)≤0.02 ppm
Calcium (Ca)≤0.1 ppm
Cadmium (Cd)≤0.01 ppm
Cobalt (Co)≤0.01 ppm
Chromium (Cr)≤0.01 ppm
Copper (Cu)≤0.01 ppm
Iron (Fe)≤0.05 ppm
Gallium (Ga)≤0.02 ppm
Indium (In)≤0.02 ppm
Potassium (K)≤0.05 ppm
Lithium (Li)≤0.01 ppm
Magnesium (Mg)≤0.05 ppm
Manganese (Mn)≤0.01 ppm
Molybdenum (Mo)≤0.05 ppm
Sodium (Na)≤0.1 ppm
Nickel (Ni)≤0.01 ppm
Lead (Pb)≤0.02 ppm
Platinum (Pt)≤0.02 ppm
Antimony (Sb)≤0.01 ppm
Tin (Sn)≤0.02 ppm
Strontium (Sr)≤0.02 ppm
Titanium (Ti)≤0.02 ppm
Thallium (Tl)≤0.02 ppm
Vanadium (V)≤0.02 ppm
Zinc (Zn)≤0.05 ppm
Zirconium (Zr)≤0.02 ppm